Showing results: 16 - 23 of 23 items found.
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Venture -
SV Probe, Inc.
SV TCL's VentureTM line of cantilever probe cards, represents the finest epoxy technology on the market and are perfect for logic testing. The Venture line includes an extensive array of cantilever cards, single to multi-die for a variety of test systems. Our Venture FX™ fine pitch cantilever cards are ideal for LCD driver testing, with higher probe counts for greater density bond pad layouts.
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CIS -
SV Probe, Inc.
CMOS Image Sensors (CIS) allow camera functions in high tech tablets and smart phones. Testing CIS devices utilizes cantilever technology and layering for high density probe layouts. SV TCL''s CIS probe card products employ a wide variety of materials ensuring they are a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features include:
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TR7502DT -
Test Research, Inc.
Equipped with a 1-CCD high resolution color camera, the TR7502 DT desktop automated optical inspection system offers TRI' hallmark Dynamic Imaging technology for powerful pre/post reflow inspection in a compact economical solution. The system features a highly flexible coaxial RGB+W lighting system with low-angle lighting for better inspection of polarity and black components and is capable of inspecting 01005 fine pitch components in both lead-free and legacy PCB assemblies
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TR7600 SII -
Test Research, Inc.
Featuring advanced automated 3D X-ray inspection of PCBAs, the TR7600 SII high speed scanning with multiple resolutions in a single program. Automatic Pass/Fail determination uses 2D + 3D images provided using 6-axis control and ultra-high-speed multiple angle cameras with automatic board warp compensation. TR7600 SII is ideal for inspection of fine pitch 01005 components, BGAs, PoPs, LGAs and other bottom termination components on both sides of the PCBA, including complex Pressfit connectors.
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TR7700 SII DT -
Test Research, Inc.
Specially designed for high precision pre-reflow inspection, the TR7700 SII DT is a high performance desktop AOI solution, featuring a large 4 MP color camera and capable of inspection speeds of up to 120 cm2/sec at 15 µm. The system combines a highly flexible RGB+W lighting system with low-angle lighting and TRI's trademark dynamic imaging for better inspection of polarity and black components and is capable of inspecting 01005 fine pitch components in both lead-free and legacy PCB assemblies.
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TR7550 SII -
Test Research, Inc.
Combining a 3CCD top-view color camera with four angled cameras for unparalleled inspection coverage, the TR7550 SII automated optical inspection system offers TRI' hallmark on-the-fly Dynamic Imaging technology for high speed vibration free pre/post reflow inspection. The system features a highly flexible RGB+W lighting system with low-angle illumination for better inspection of polarity and black components and is capable of inspecting 01005 fine pitch components in both lead-free and legacy PCB assemblies.
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TR7700 SII -
Test Research, Inc.
Featuring a large 4 MP color camera and capable of inspection speeds of up to 120 cm2/sec at 15 µm, the TR7700 SII automated optical inspection system offers TRI' trademark Dynamic Imaging technology for powerful pre/post reflow inspection in a slimmer, faster and more economical package. The system features an advanced, highly flexible RGB+W lighting system with ultra-low-angle lighting for better inspection of polarity and black components and is capable of inspecting 01005 fine pitch components in both lead-free and legacy PCB assemblies.
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Corelis, Inc.
The benefits of boundary-scan are noticed in all phases of a product life cycle. By coupling the power of Corelis boundary-scan tools with an In-Circuit Tester (ICT), a complete, integrated solution is available that offers the best advantages of both technologies.Boundary-scan operates as the perfect companion to ICT. Boundary-scan is capable of testing areas of printed circuit board assemblies that are difficult to access due to physical space constraints and loss of physical access, which is often due to fine pitch components such as Ball Grid Array (BGA) devices. Conversely, the ICT is able to check the non-boundary-scan compatible portion of the unit under test (UUT) such as analog.
